SCDM- Indrashil University International Conference on Semiconductor Chip Design Manufacturing ( SCDM-2025 )

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Call for Papers

Author Guidelines

Manuscript Templates for Conference

Prospective authors from India and abroad are invited to submit their full papers describing original, previously unpublished, complete work (not currently under review by any other conference/ journal) by electronic submission.

The maximum number of pages for conference paper is 8 pages. Papers need to be submitted in the .docx/Latex format. A submission should not be intended to get reviews from the reviewers for the sole purpose of improving on the quality of the paper. A submission implies that the author intends to ultimately register the paper upon a favorable response from the conference organizers.

All submissions will be rigorously peer-reviewed by a panel of experts. Manuscripts should not contain Embedded links, Scanned images and Header and Footer. Email submission will not be accepted.

All queries related to the conference shall be addressed to scdm2025@indrashiluniversity.edu.in

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Submission Guidelines

Authors should submit their manuscripts online via "Submit a Manuscript" link on the homepage of the journal. Manuscripts are accepted only in Word format. First-time users must create an account first.

Authors should submit manuscripts together with these documents, including manuscript body, title page, a turnitin similarity rate report, and a turnitin AI writing rate report.

Originality: Content must be original, unpublished, and not under consideration elsewhere

Plagiarism: Must be below 10%

AI-Generated Content: Must be 0% (no AI-generated content is allowed).

Language: Must be written in high

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Paper Submission

Submit Your Paper

Standard 6 Page, IEEE 2 Column Format by email at
scdm2025@indrashiluniversity.edu.in

Note :

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Publication Details

Publication

All accepted and presented papers will be published in IET Conference Proceedings (ISSN: 2732-4494)

Extended Version of selected quality papers may be considered for publication in Proceedings on Engineering Sciences (ISSN: 2620-2832)